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High-Density Interconnect

HDI PCB Manufacturing

When your design has to shrink but the feature count keeps growing, HDI (High-Density Interconnect) PCBs pack more into less space - microvias, blind and buried vias, and tighter trace geometries that standard boards cannot reach.

PCB Layers1 - 32 / multiple
ViaMicrovia / blind & buried
Fine Pitch0.35 pitch micro BGA
MaterialFR-4 & HDI stack-ups

§ 01 · HDI Fabrication

HDI PCB Fabrication

We build high-density interconnect boards with laser-drilled microvias and blind/buried via stacks, enabling 1-32 layer designs in a much smaller footprint. Every panel is fabricated to your stack-up and 100% E-tested before shipment.

  • PCB Layers1 - 32 or multiple layers
  • Via TechnologyMicrovia, blind & buried vias
  • PCB Thickness0.4 - 6.0mm
  • Minimum Tracking/Spacing3.0mil
  • Copper Weight1oz - 6oz
HDI PCB fabrication
§ 01 · HDI Fabrication

§ 02 · HDI Assembly

HDI PCB Assembly

Fine-pitch SMT assembly for the dense packages HDI designs demand. We handle 0.35mm-pitch micro BGAs and advanced QFNs with AOI and X-ray inspection on every critical joint.

  • Fine Pitch0.35 pitch micro BGA, AQFN
  • PackagesQFP, QFN, AQFN
  • ComplianceRoHS compliant assembly
  • InspectionAOI & X-ray
HDI PCB assembly
§ 02 · HDI Assembly

§ 03 · HDI to Volume

From HDI Prototype to Volume

Your HDI prototype is the first step. The same engineering team and factory scale it to production volumes with box build and full product assembly - one accountable partner from first article to mass production.

  • First ArticleVerification before volume
  • Scale1 unit → 100K units
  • Box BuildEnclosures & full assembly
HDI prototype to volume
§ 03 · HDI to Volume

§ 04 · Specialized Technologies

Specialized PCB Technologies

Targeted manufacturing for demanding designs - high-density interconnect, flex and rigid-flex, metal core for thermal management, and low-loss RF laminates, all built in one factory.

Flexible & Rigid-Flex PCB →

Aluminum / Metal Core PCB →

Rogers / High-Frequency PCB →

Low-Volume PCB Assembly →

Specialized PCB technologies behind every industry
§ 04 · Specialized Technologies

Get Your HDI Quote

Upload your Gerber and BOM for an instant online quote, or review our full manufacturing capabilities first.

Get a Quote Manufacturing Capabilities

Why BokTech over large PCB marketplaces

Big marketplaces are built to push templates and volume. BokTech is a Shenzhen factory that acts as your engineering partner from the first prototype to production - one accountable team, the hard-to-build technologies, and a quality gate on every board.

  • Engineering partner

    Free DFM review and NPI support from our Shenzhen engineering team - not just a file-to-board queue.

  • Prototype-first

    From a single board, with no minimum that forces you to over-order. Scale 1 → 100K units on the same line.

  • One factory, turnkey

    Fabrication, SMT/through-hole assembly, box build, injection molding and supply chain under one roof.

  • Hard-to-build tech

    HDI microvias, flex/rigid-flex, aluminum MCPCB and Rogers/PTFE RF; 0.35mm micro BGA with AOI & X-ray.

  • Quality on every board

    100% E-test before shipment, RoHS-compliant, functional test on request.

  • Startup & crowdfunding ready

    Consigned, turnkey or hybrid material models; same-day pick/pack and Kickstarter / Indiegogo / Crowdsupply fulfillment.

Frequently Asked Questions

What is your minimum order quantity?
From a single board. We run low-volume and small-batch assembly with no minimum that forces you to over-order - start with a prototype and scale to 100K units on the same line.
How do I get a quote?
Upload your Gerber and BOM through our online quote tool for an instant estimate, or contact our engineering team for a tailored review. Consigned, turnkey and hybrid material models are all supported.
What PCB materials and technologies do you support?
FR-4, Aluminum (metal core / MCPCB), Flexible and rigid-flex, HDI with microvias and blind/buried vias, and Rogers / PTFE high-frequency laminates - from 1 to 32 layers.
What assembly capabilities do you have?
Machine SMT and through-hole assembly, fine-pitch down to 0.35mm micro BGA and AQFN, RoHS-compliant, with AOI and X-ray inspection on fine-pitch joints.
Do you test every board?
Yes. Every panel is 100% E-tested before shipment, with AOI and X-ray on critical joints and functional testing available on request.
What are your lead times?
We offer fast turnaround from our Shenzhen factory. A prototype can move straight to volume on the same engineering team and line, with first-article verification before scale.
Which shipping methods do you use for global delivery?
We ship worldwide via DHL, FedEx and UPS, with typical transit of 3-6 business days, and by Registered Post for 8-20 business days. Orders are picked, packed and dispatched the same day they are ready.